ESPEC TSD-100 Thermal Shock Chamber (60~300°C, -65~0°C, Plastic mold IC 5kg)
制造商: ESPEC Model: TSD-100 保障: 12 Month - 报价要求
- 联系
Test area:
High-temp. exposure range: +60 to +300°C
Low-temp. exposure range: -65 to 0°C
Hot chamber:
Temperature pull-down time: Within 100 minutes from ambient temperature to +300°C
Cold chamber:
Temperature pull-down time: Within 90 minutes from ambient temperature to -77°C
Temperature recovery performance:
Condition:
High temperature exposure: +270°C (40 minutes)
Low temperature exposure: -40°C (40 minutes)
Specimen: Plastic mold IC 5 kg
Temperature recovery time: Within 5 minutes
Test area dimensions (mm): W710×H345×D410
- 质量承诺
- 正品保修
- 送货到家
- 交易简单化